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  data sheet ics830154agi-08 revision a march 29, 2010 1 ?2010 integrated device technology, inc. over-voltage tolerant 1.5v, 1:4 fanout buffer ics830154i-08 1 2 3 4 8 7 6 5 oe v dd gnd q4 clk_in q2 q3 q1 general description the ics830154i-08 is an lvcmos, over-voltage tolerant clock fanout buffer targeted for clock generation in high-performance telecommunication, networking and computing applications. the device is optimized for low-skew clock distribution in low-voltage applications. the input over-voltage tolerance enables using this device in mixed-mode voltage applications. an output enable pin controls whether the outputs are in the active or high impedance state. guaranteed output skew characteristics make the ics830154i-08 ideal for those applications demanding well defined performance and repeatability. the ics830154i-08 is packaged in a small 8-tssop and in an 8-soic package. block diagram clk_in oe q1 q2 q3 q4 pulldown pullup features ? low-skew 1:4 fanout buffer ? supports 3.3v, 2.5v, 1.8v and 1.5v power supplies ? lvcmos input and output levels ? 3.6v over-voltage tolerance at the clock and control inputs ? supports clock frequencies up to 160mhz ? lvcmos compatible control input for output disable ? output disabled to a high-impedance state ? -40c to 85c ambient operating temperature ? available in lead-free rohs 6 packages (8-tssop, 8-soic) hiperclocks? ic s ics830154agi-08 8-tssop 4.4mm x 3.0mm x 0.925mm package body g-package top view ics830154ami-08 8-soic, 150 mil 3.9mm x 4.9mm x 1.375mm package body m-package top view pin assignments
ics830154agi-08 revision a march 29, 2010 2 ?2010 integrated device technology, inc. ics830154i-08 data sheet over-voltage tolerant 1.5v, 1:4 fanout buffer table 1. pin descriptions note: pullup and pulldown refer to internal input resistors. see table 2, pin characteristics, for typical values. table 2. pin characteristics function table table 3. oe configuration table note: oe is an asynchronous control. number name type description 1 clk_in input pulldown single-ended clock input. lvcmos interface levels. 2 q1 output single-ended clock output. lvcmos interface levels. 3 q2 output single-ended clock output. lvcmos interface levels. 4 q3 output single-ended clock output. lvcmos interface levels. 5 q4 output single-ended clock output. lvcmos interface levels. 6 gnd power power supply ground. 7v dd power power supply pin. 8 oe input pullup output enable pin. see table 3. lvcmos interface levels. symbol parameter test conditions minimum typical maximum units c in input capacitance 4pf c pd power dissipation capacitance v dd = 3.465v 14 pf v dd = 2.375v 13 pf v dd = 1.95v 13 pf v dd = 1.6v 12 pf r pullup input pullup resistor 51 k ? r pulldown input pulldown resistor 51 k ? r out output impedance v dd = 3.3v 5% 9 ? v dd = 2.5v 5% 10 ? v dd = 1.8v 0.15v 12 ? v dd = 1.5 0.1v 15 ? input operation oe 0 q[4:1] disabled (high-impedance) 1 (default) q[4:1] enabled
ics830154agi-08 revision a march 29, 2010 3 ?2010 integrated device technology, inc. ics830154i-08 data sheet over-voltage tolerant 1.5v, 1:4 fanout buffer absolute maximum ratings note: stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these ratings are stress specifications only . functional operation of product at t hese conditions or any conditions beyond those listed in the dc characteristics or ac characteristics is not implied. exposure to absolute maximum rating conditions for extended periods may affect product reliability. dc electrical characteristics table 4a. power supply dc characteristics, v dd = 3.3v 5%, t a = -40c to 85c table 4b. power supply dc characteristics, v dd = 2.5v 5%, t a = -40c to 85c table 4c. power supply dc characteristics, v dd = 1.8v 0.15v, t a = -40c to 85c table 4d. power supply dc characteristics, v dd = 1.5v 0.1v, t a = -40c to 85c item rating supply voltage, v dd 4.6v inputs, v i 3.6v outputs, v o -0.5v to v dd + 0.5v package thermal impedance, ja 8 lead tssop 8 lead soic 121.5c/w (0 mps) 103c/w (0 mps) storage temperature, t stg -65 c to 150 c symbol parameter test conditions minimum typical maximum units v dd power supply voltage 3.135 3.3 3.465 v i ddq quiescent power supply current inputs open, outputs unloaded 1 ma symbol parameter test conditio ns minimum typical maximum units v dd power supply voltage 2.375 2.5 2.625 v i ddq quiescent power supply current inputs open, outputs unloaded 1 ma symbol parameter test conditio ns minimum typical maximum units v dd power supply voltage 1.65 1.8 1.95 v i ddq quiescent power supply current inputs open, outputs unloaded 1 ma symbol parameter test conditio ns minimum typical maximum units v dd power supply voltage 1.4 1.5 1.6 v i ddq quiescent power supply current inputs open, outputs unloaded 1 ma
ics830154agi-08 revision a march 29, 2010 4 ?2010 integrated device technology, inc. ics830154i-08 data sheet over-voltage tolerant 1.5v, 1:4 fanout buffer table 4e. lvcmos dc characteristics, v dd = 3.3v 5%, t a = -40c to 85c table 4f. lvcmos dc characteristics, v dd = 2.5v 5%, t a = -40c to 85c table 4g. lvcmos dc characteristics, v dd = 1.8v 0.15v, t a = -40c to 85c symbol parameter test conditio ns minimum typical maximum units v ih input high voltage 0.65 * v dd 3.6 v v il input low voltage -0.3 0.35 * v dd v i ih input high current clk_in v dd = v in = 3.465v 150 a oe v dd = v in = 3.465v 5 a i il input low current clk_in v dd = 3.465v, v in = 0v -5 a oe v dd = 3.465v, v in = 0v -150 a v oh output high voltage q[4:1] i oh = -12ma 2.6 v v ol output low voltage q[4:1] i ol = 12ma 0.5 v symbol parameter test conditions minimum typical maximum units v ih input high voltage 0.65 * v dd 3.6 v v il input low voltage -0.3 0.35 * v dd v i ih input high current clk_in v dd = v in = 2.625v 150 a oe v dd = v in = 2.625v 5 a i il input low current clk_in v dd = 2.625v, v in = 0v -5 a oe v dd = 2.625v, v in = 0v -150 a v oh output high voltage q[4:1]] i oh = -12ma 1.8 v v ol output low voltage q[4:1] i ol = 12ma 0.5 v symbol parameter test conditio ns minimum typical maximum units v ih input high voltage 0.65 * v dd 3.6 v v il input low voltage -0.3 0.35 * v dd v i ih input high current clk_in v dd = v in = 1.95v 150 a oe 5a i il input low current clk_in v dd = 1.95v, v in = 0v -5 a oe v dd = 1.95v, v in = 0v -150 a v oh output high voltage q[4:1] i oh = -6ma v dd ? 0.45 v v ol output low voltage q[4:1] i ol = 6ma 0.45 v
ics830154agi-08 revision a march 29, 2010 5 ?2010 integrated device technology, inc. ics830154i-08 data sheet over-voltage tolerant 1.5v, 1:4 fanout buffer table 4h. lvcmos dc characteristics, v dd = 1.5v 0.1v, t a = -40c to 85c ac electrical characteristics table 5a. ac characteristics, v dd = 3.3v 5%, t a = -40c to 85c note: electrical parameters are guaranteed over the specified am bient operating temperature rang e, which is established when de vice is mounted in a test socket with maintained transverse airflow great er than 500 lfpm. device will meet specifications after therma l equilibrium has been reached under these conditions. note: characterized up to f out 150mhz. note 1: measured from the v dd /2 of the input to v dd /2 of the output. note 2: this parameter is defined in accordance with jedec standard 65. note 3: defined as skew between outputs at the same su pply voltage and with equal load conditions. measured at v dd /2. note 4: defined as skew between outputs on different devices o perating at the same supply voltage , same temperature, same frequ ency and with equal load conditions. using the same type of i nputs on each device, the out puts are measured at v dd /2. symbol parameter test conditions minimum typical maximum units v ih input high voltage 0.65 * v dd 3.6 v v il input low voltage -0.3 0.35 * v dd v i ih input high current clk_in v dd = v in = 1.6v 150 a oe v dd = v in = 1.6v 5 a i il input low current clk_in v dd = 1.6v, v in = 0v -5 a oe v dd = 1.6v, v in = 0v -150 a v oh output high voltage q[4:1] i oh = -4ma 0.75 * v dd v v ol output low voltage q[4:1] i ol = 4ma 0.25 * v dd v symbol parameter test conditio ns minimum typical maximum units f out output frequency 160 mhz tp lh propagation delay (low to high transition); note 1 0.7 1.45 ns tp hl propagation delay (high to low transition); note 1 0.7 1.45 ns t plz, t phz disable time (active to high-impedance) 10 ns t pzl, t pzh enable time (high-impedance to disable) 10 ns tsk(o) output skew; note 2, 3 250 ps tsk(pp) part-to-part skew; note 2, 4 800 ps t jit buffer additive phase jitter, rms; refer to additive phase jitter section 25mhz, integration range: 12khz - 5mhz 0.094 ps t r / t f output rise/fall time 10% to 90% 0.35 1.2 ns odc output duty cycle 48 52 %
ics830154agi-08 revision a march 29, 2010 6 ?2010 integrated device technology, inc. ics830154i-08 data sheet over-voltage tolerant 1.5v, 1:4 fanout buffer table 5b. ac characteristics, v dd = 2.5v 5%, t a = -40c to 85c note: electrical parameters are guaranteed over the specified am bient operating temperature rang e, which is established when de vice is mounted in a test socket with maintained transverse airflow great er than 500 lfpm. device will meet specifications after therma l equilibrium has been reached under these conditions. note: characterized up to f out 150mhz. note 1: measured from the v dd /2 of the input to v dd /2 of the output. note 2: this parameter is defined in accordance with jedec standard 65. note 3: defined as skew between outputs at the same su pply voltage and with equal load conditions. measured at v dd /2. note 4: defined as skew between outputs on different devices o perating at the same supply voltage , same temperature, same frequ ency and with equal load conditions. using the same type of i nputs on each device, the out puts are measured at v dd /2. table 5c. ac characteristics, v dd = 1.8v 0.15v, t a = -40c to 85c for notes, see table 5b above. symbol parameter test conditio ns minimum typical maximum units f out output frequency 160 mhz tp lh propagation delay (low to high transition); note 1 0.8 1.7 ns tp hl propagation delay (high to low transition); note 1 0.8 1.7 ns t plz, t phz disable time (active to high-impedance) 10 ns t pzl, t pzh enable time (high-impedance to disable) 10 ns tsk(o) output skew; note 2, 3 250 ps tsk(pp) part-to-part skew; note 2, 4 800 ps t jit buffer additive phase jitter, rms; refer to additive phase jitter section 25mhz, integration range: 12khz - 5mhz 0.076 ps t r / t f output rise/fall time 10% to 90% 0.35 1.2 ns odc output duty cycle 48 52 % symbol parameter test conditio ns minimum typical maximum units f out output frequency 160 mhz tp lh propagation delay (low to high transition); note 1 1.1 2.1 ns tp hl propagation delay (high to low transition); note 1 1.1 2.1 ns t plz, t phz disable time (active to high-impedance) 10 ns t pzl, t pzh enable time (high-impedance to disable) 10 ns tsk(o) output skew; note 2, 3 250 ps tsk(pp) part-to-part skew; note 2, 4 800 ps t jit buffer additive phase jitter, rms; refer to additive phase jitter section 25mhz, integration range: 12khz - 5mhz 0.193 ps t r / t f output rise/fall time 0.63v to 1.17v 0.12 0.6 ns odc output duty cycle 47 53 %
ics830154agi-08 revision a march 29, 2010 7 ?2010 integrated device technology, inc. ics830154i-08 data sheet over-voltage tolerant 1.5v, 1:4 fanout buffer table 5d. ac characteristics, v dd = 1.5v 0.1v, t a = -40c to 85c note: electrical parameters are guaranteed over the specified am bient operating temperature rang e, which is established when de vice is mounted in a test socket with maintained transverse airflow great er than 500 lfpm. device will meet specifications after therma l equilibrium has been reached under these conditions. note: characterized up to f out 150mhz. note 1: measured from the v dd /2 of the input to v dd /2 of the output. note 2: this parameter is defined in accordance with jedec standard 65. note 3: defined as skew between outputs at the same su pply voltage and with equal load conditions. measured at v dd /2. note 4: defined as skew between outputs on different devices o perating at the same supply voltage , same temperature, same frequ ency and with equal load conditions. using the same type of i nputs on each device, the out puts are measured at v dd /2. symbol parameter test conditio ns minimum typical maximum units f out output frequency 160 mhz tp lh propagation delay (low to high transition); note 1 1.5 2.7 ns tp hl propagation delay (high to low transition); note 1 1.5 2.7 ns t plz, t phz disable time (active to high-impedance) 10 ns t pzl, t pzh enable time (high-impedance to disable) 10 ns tsk(o) output skew; note 2, 3 250 ps tsk(pp) part-to-part skew; note 2, 4 800 ps t jit buffer additive phase jitter, rms; refer to additive phase jitter section 25mhz, integration range: 12khz - 5mhz 0.266 ps t r / t f output rise/fall time 0.525v to 0.975v 0.12 0.6 ns odc output duty cycle 47 53 %
ics830154agi-08 revision a march 29, 2010 8 ?2010 integrated device technology, inc. ics830154i-08 data sheet over-voltage tolerant 1.5v, 1:4 fanout buffer additive phase jitter (1.5v output) the spectral purity in a band at a specific offset fr om the fundamental compared to the power of t he fundamental is called the dbc phase noise. this value is normally expressed using a phase noise plot and is most often the specified plot in many applications. phase noise is defined as the ratio of the noise power present in a 1hz band at a specified offset from the fundamen tal frequency to the power value of the fundamental. this ratio is expressed in decibels (dbm) or a ratio of the power in the 1hz band to the power in the fundamental. when the required offset is specif ied, the phase noise is called a dbc value, which simply means dbm at a specif ied offset from the fundamental. by investigating jitter in the frequency domain, we get a better understanding of its effect s on the desired application over the entire time record of the signal. it is mathematically possible to calculate an expected bit error rate given a phase noise plot. as with most timing specificat ions, phase noise measurements has issues relating to the limitations of the equipment. often the noise floor of the equipment is higher than the noise floor of the device. this is illustrated above. the device me ets the noise floor of what is shown, but can actually be lowe r. the phase noise is dependent on the input source and measurement equipment. the source generator "ifr2042 10k hz ? 56.4ghz low noise signal generator as external input to an agilent 8133a 3ghz pulse generator". additive phase jitter @ 25mhz 12khz to 5mhz = 0.266ps (typical) ssb phase noise dbc/hz offset from carr ier frequency (hz)
ics830154agi-08 revision a march 29, 2010 9 ?2010 integrated device technology, inc. ics830154i-08 data sheet over-voltage tolerant 1.5v, 1:4 fanout buffer parameter measureme nt information 3.3v output load ac test circuit 1.8v output load ac test circuit output skew 2.5v output load ac test circuit 1.5v output load ac test circuit part-to-part skew scope qx lvcmos gnd v dd 1.65v5% -1.65v5% scope qx lvcmos gnd v dd 0.9v0.075v -0.9v0.075v t sk(o) v dd 2 v dd 2 qx qy scope qx lvcmos gnd v dd 1.25v5% -1.25v5% scope qx lvcmos gnd v dd 0.75v0.05v -0.75v0.05v qx t sk(pp) v dd 2 v dd 2 part 1 part 2 qy
ics830154agi-08 revision a march 29, 2010 10 ?2010 integrated device technology, inc. ics830154i-08 data sheet over-voltage tolerant 1.5v, 1:4 fanout buffer parameter measurement in formation, continued output enable/disable time 1.5v output rise/fall time 2.5v and 3.3v output rise/fall time output duty cycle/pulse width/period 1.8v output rise/fall time propagation delay v dd /2 v dd /2 v dd /2 v dd /2 v oh 0v v dd t dis t en output qx (see note) oe (high-level enabling) 0.525v 0.975v 0.975v 0.525v t r t f q1:q4 10% 90% 90% 10% t r t f q1:q4 t period t pw t period odc = v dd 2 v dd 2 x 100% t pw q1:q4 0.63v 1.17v 1.17v 0.63v t r t f q1:q4 tp lh tp hl v dd 2 v dd 2 v dd 2 v dd 2 q1:q4 clk_in
ics830154agi-08 revision a march 29, 2010 11 ?2010 integrated device technology, inc. ics830154i-08 data sheet over-voltage tolerant 1.5v, 1:4 fanout buffer applications information recommendations for un used output pins o utputs: lvcmos outputs all unused lvcmos outputs can be left floating. there should be no trace attached.
ics830154agi-08 revision a march 29, 2010 12 ?2010 integrated device technology, inc. ics830154i-08 data sheet over-voltage tolerant 1.5v, 1:4 fanout buffer power considerations this section provides information on power dissipati on and junction temperature for the ics830154i-08. equations and example calculations are also provided. 1. power dissipation. the total power dissipation for theics830154i-08 is the sum of th e core power plus the power dissipation in the load(s). the fo llowing is the power dissipation for v dd = 3.3v + 5% = 3.465v, which gives worst case results. power (core) max = v dd_max * i dd_max = 3.465v *1ma = 3.465mw total static power: = power (core) max = 3.465mw dynamic power dissipation at f out_max (160mhz) total power (160mhz) = [(c pd * n) * frequency * (v ddo ) 2 ] = [(14pf *4) * 160mhz * (3.465v) 2 ] = 107.6mw n = number of outputs total power = static power + dynamic power dissipation = 3.465mw + 107.6mw = 111.065mw 2. junction temperature. junction temperature, tj, is the temperat ure at the junction of the bond wire and bond pad, and directly affects the reliabilit y of the device. the maximum recommended junction temperature is 125c. limiting the in ternal transistor junction temperature, tj, to 125c ensures that the bond wire and bond pad temperature remains below 125c. the equation for tj is as follows: tj = ja * pd_total + t a tj = junction temperature ja = junction-to-ambient thermal resistance pd_total = total device power dissipation (example calculation is in section 1 above) t a = ambient temperature in order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance ja must be used. assuming no air flow and a multi-layer board, the appropriate va lue is 121.5c/w per table 6a below. therefore, tj for an ambient temperature of 85c with all outputs switching is: 85c + 0.111w *121.5c/w = 98.5c. th is is below the limit of 125c. this calculation is only an example. tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of board (multi-layer). table 6a. thermal resistance ja for 8 lead tssop, forced convection table 6b. thermal resistance ja for 8 lead soic, forced convection ja by velocity meters per second 012.5 multi-layer pcb, jedec standard test boards 121.5c/w 1 17.3c/w 115.3c/w ja by velocity meters per second 012.5 multi-layer pcb, jedec standard test boards 103c/w 94c/w 89c/w
ics830154agi-08 revision a march 29, 2010 13 ?2010 integrated device technology, inc. ics830154i-08 data sheet over-voltage tolerant 1.5v, 1:4 fanout buffer reliability information table 7a. ja vs. air flow table for a 8 lead tssop table 7b. ja vs. air flow table for a 8 lead soic transistor count the transistor count for ics830154i-08 is: 191 ja vs. air flow meter per second 012.5 multi-layer pcb, jedec standard test boards 121.5c/w 117.3c/w 115.3c/w ja vs. air flow meter per second 012.5 multi-layer pcb, jedec standard test boards 103c/w 94c/w 89c/w
ics830154agi-08 revision a march 29, 2010 14 ?2010 integrated device technology, inc. ics830154i-08 data sheet over-voltage tolerant 1.5v, 1:4 fanout buffer package outline and package dimensions package outline - g suffix for 8 lead tssop table 8a. package dimensions for 8lead tssop reference document: jedec publication 95, mo-153 package outline - m suffix for 8 lead soic table 8b. package dimensions reference document: jedec publication 95, ms-012 all dimensions in millimeters symbol minimum maximum n 8 a 1.20 a1 0.5 0.15 a2 0.80 1.05 b 0.19 0.30 c 0.09 0.20 d 2.90 3.10 e 6.40 basic e1 4.30 4.50 e 0.65 basic l 0.45 0.75 0 8 aaa 0.10 all dimensions in millimeters symbol minimum maximum n 8 a 1.35 1.75 a1 0.10 0.25 b 0.33 0.51 c 0.19 0.25 d 4.80 5.00 e 3.80 4.00 e 1.27 basic h 5.80 6.20 h 0.25 0.50 l 0.40 1.27 0 8
ics830154agi-08 revision a march 29, 2010 15 ?2010 integrated device technology, inc. ics830154i-08 data sheet over-voltage tolerant 1.5v, 1:4 fanout buffer ordering information table 9. ordering information note: parts that are ordered with an "lf" suffix to the part number are the pb-free configuration and are rohs compliant. part/order number marking package shipping packaging temperature 830154agi-08lf ai08l lead-free, 8 lead tssop tube -40 c to 85 c 830154agi-08lft ai08l lead-free, 8 lead tssop 2500 tape & reel -40 c to 85 c 830154AMI-08LF 154ai08l lead-free, 8 lead soic tube -40 c to 85 c 830154AMI-08LFt 154ai08l lead-free, 8 lead soic 2500 tape & reel -40 c to 85 c while the information presented herein has been checked for both accuracy and reliability, integrated device technology (idt) a ssumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. no other circuits, patents, or l icenses are implied. this product is intended for use in normal commercial and industrial applications. any other applications, such as those requiring high reliability or other extraordinary environmental requirements are not recommended without additional processing by idt. idt reserves the right to change any circuitry or specifications without notice. idt does not aut horize or warrant any idt product for use in life support devices or critical medical instruments.
ics830154i-08 data sheet over-voltage tolerant 1.5v, 1:4 fanout buffer disclaimer integrated device technology, inc. (idt) and its subsidiaries reserve the ri ght to modify the products and/or specif ications described herein at any time and at idt? s sole discretion. all information in this document, including descriptions of product features and performance, is s ubject to change without notice. performance specifications and the operating parameters of the described products ar e determined in the independent state and are not guaranteed to perform the same way when in stalled in customer products. the informa tion contained herein is provided without re presentation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of idt?s products for any partic ular purpose, an implied warranty of merc hantability, or non-infringement of the in tellectual property rights of others. this document is presented only as a guide and does not convey any license under intellectual property rights of idt or any third parties. idt?s products are not intended for use in life support systems or similar devices where the failure or malfunction of an idt p roduct can be reasonably expected to significantly affect the health or safety of users. anyone using an idt product in such a manner does so at their own ri sk, absent an express, written agreement by idt. integrated device technology, idt and the idt logo are registered tr ademarks of idt. other trademarks and service marks used he rein, including protected names, logos and designs, are the property of idt or their respective third party owners. copyright 2010. all rights reserved. 6024 silver creek valley road san jose, california 95138 sales 800-345-7015 (inside usa) +408-284-8200 (outside usa) fax: 408-284-2775 www.idt.com/go/contactidt technical support netcom@idt.com +480-763-2056


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